T5 Pro-Grade+ Hybrid Thermal Paste (5g)
Easily apply ultra-performance hybrid thermal paste to your CPU and GPU, designed for highly efficient computer setups. Ideal for overclocking enthusiasts, with enough paste for approximately 10–20 applications.
Key Features
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Pro-Grade Hybrid Formula
Designed with hybrid silicone and nano-diamond particles for ultra-performance thermal management. -
Nano-Diamond Particles for Superior Heat Transmission
Hybrid silicone and nano-diamond micro-particles help ensure minimal thermal resistance for quick and efficient heat transmission.
Optimized for getting the most out of your processor and air or liquid heatsink cooler, making it suitable for overclockers. -
Non-Curing, Non-Conductive & Safe
- Non-curing compound: delivers top performance right from the start, with no curing time required.
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Non-electrically conductive: reduces electrical risk when applying near sensitive components.
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Easy Application with Included Accessories
- Spreader included for even, consistent coverage on CPU or GPU surfaces.
- Wipes included to remove old thermal paste and help ensure a clean surface for a strong bond with the heatsink.
Product Type
- Thermally conductive compound
Technical Specifications
| Specification | Value |
|---|---|
| Thermal Conductivity | 5.2 W/mK |
| Thermal Resistance | 0.04°C·cm²/W @ 60 psi |
| Form | Non-curing compound |
| Specific Gravity | 2.6 |
| Operating Temperature | -50°C to 250°C |
| Colour | Grey |
| Viscosity | 6,000,000 (mPa·s / 22°C) |
| Weight | 5g |
T5 Pro-Grade+ thermal paste provides a high-performance, easy-to-apply solution for users looking to optimize CPU and GPU thermal efficiency.
